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ON Semiconductort
Octal D-Type Flip-Flop with 3-State Output
MC74VHC374
The MC74VHC374 is an advanced high speed CMOS octal flip-flip with 3-state output fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. This 8-bit D-type flip-flop is controlled by a clock input and an output enable input. When the output enable input is high, the eight outputs are in a high impedance state. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The inputs tolerate voltages up to 7V, allowing the interface of 5V systems to 3V systems. * High Speed: fmax = 185MHz (Typ) at VCC = 5V * Low Power Dissipation: ICC = 4A (Max) at TA = 25C * High Noise Immunity: VNIH = VNIL = 28% VCC * Power Down Protection Provided on Inputs * Balanced Propagation Delays * Designed for 2V to 5.5V Operating Range * Low Noise: VOLP = 0.9V (Max) * Pin and Function Compatible with Other Standard Logic Families * Latchup Performance Exceeds 300mA * ESD Performance: HBM > 2000V; Machine Model > 200V * Chip Complexity: 266 FETs or 66.5 Equivalent Gates
DW SUFFIX 20-LEAD SOIC WIDE PACKAGE CASE 751D-05
DT SUFFIX 20-LEAD TSSOP PACKAGE CASE 948E-02
M SUFFIX 20-LEAD SOIC EIAJ PACKAGE CASE 967-01 ORDERING INFORMATION MC74VHCXXXDW SOIC WIDE MC74VHCXXXDT TSSOP MC74VHCXXXM SOIC EIAJ
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These devices are available in Pb-free package(s). Specifications herein apply to both standard and Pb-free devices. Please see our website at www.onsemi.com for specific Pb-free orderable part numbers, or contact your local ON Semiconductor sales office or representative.
(c) Semiconductor Components Industries, LLC, 2006
March, 2006 - Rev. 5
1
Publication Order Number: MC74VHC374/D
D0 D1 D2 DATA INPUTS D3 D4 D5 D6 D7 CP
3 4 7 8 13 14 17 18 11
2 5 6 9 12 15 16 19
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 NONINVERTING OUTPUTS
OE Q0 D0 D1 Q1 Q2 D2 D3 Q3 GND
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
VCC Q7 D7 D6 Q6 Q5 D5 D4 Q4 CP
OE
1
Figure 2. PIN ASSIGNMENT
Figure 1. LOGIC DIAGRAM FUNCTION TABLE
INPUTS OE L L L H CP D H L X X OUTPUT Q H L No Change Z
L, H, X
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* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute-maximum-rated conditions is not implied. Derating -- SOIC Packages: - 7 mW/_C from 65_ to 125_C TSSOP Package: - 6.1 mW/_C from 65_ to 125_C
III I I I I I I I I I I IIIIIIIIIIIII III I I I I I IIIIIIIIIIIII III I I III I I I I I IIIIIIIIIIIIIIIIIIIIIII I I II I I I I I I I IIIIIIIIIIIII III I I I I I I I I I I IIIIIIIIIIIII III I I I I I IIIIIIIIIIII I II I I I I I I I IIIIIIIIIIIII III I I I I I I I I I I IIIIIIIIIIIII III I I I III I I I I I I I I I I IIIIIIIIIIIII III I I I I I I I I I I IIIIIIIIIIIII III I I I I I I I I I I IIIIIIIIIIIII III I I I I I I I I I I IIIIIIIIIIIII III I I I I I I I I I I IIIIIIIIIIIII III I I I I I I I I I I IIIIIIIIIIIII III I I I I I I I I I I IIIIIIIIIIIII III I I I I I I I I IIIIIIIIIIIII III I I I I I I I I I IIIIIIIIIIIII III I I I I I IIIIIIIIIIIII III I I I I I I I I I I I I IIIIIIIIIIIII III I I I I I IIIIIIIIIIIII III I I I I I I I I I IIIIIIIIIIIIIIII IIII IIIIIII I IIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS*
SymbolIIIIIIIIIIIIII Parameter VCC Vout Tstg ICC IOK Iout Vin PD IIK Storage Temperature Power Dissipation in Still Air, DC Supply Current, VCC and GND Pins DC Output Current, per Pin Output Diode Current Input Diode Current DC Output Voltage DC Input Voltage DC Supply Voltage SOIC Packages TSSOP Package - 0.5 to VCC + 0.5 - 65 to + 150 - 0.5 to + 7.0III V - 0.5 to + 7.0III V Value - 20 75 25 20 500 450 Unit mW mA mA mA mA _C V
DC ELECTRICAL CHARACTERISTICS
RECOMMENDED OPERATING CONDITIONS
Symbol
Symbol
VOH
VOL
VCC
Vout
VIH
tr, tf
VIL
Vin
TA
Maximum Low-Level Output Voltage
Minimum High-Level Output Voltage
Maximum Low-Level Input Voltage
Minimum High-Level Input Voltage
Input Rise and Fall Time
Operating Temperature
DC Output Voltage
DC Input Voltage
DC Supply Voltage
Parameter
Parameter
Vin = VIH or VIL IOL = 4mA IOL = 8mA
Vin = VIH or VIL IOL = 50A
Vin = VIH or VIL IOH = - 4mA IOH = - 8mA
Vin = VIH or VIL IOH = - 50A
Test Conditions
VCC = 3.3V VCC = 5.0V
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2.0 3.0 to 5.5 2.0 3.0 to 5.5 VCC V 3.0 4.5 2.0 3.0 4.5 3.0 4.5 2.0 3.0 4.5 - 40 Min 2.0 0 0 0 0 1.50 VCC x 0.7 2.58 3.94 Min 1.9 2.9 4.4 + 85 Max VCC 100 20 5.5 5.5 TA = 25C Typ 0.0 0.0 0.0 2.0 3.0 4.5 ns/V Unit _C V V V 0.50 VCC x 0.3 0.36 0.36 Max 0.1 0.1 0.1 This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC ). Unused outputs must be left open. 1.50 VCC x 0.7 TA = - 40 to 85C 2.48 3.80 Min 1.9 2.9 4.4 0.50 VCC x 0.3 0.44 0.44 Max 0.1 0.1 0.1 Unit V V V V
3
1. Parameter guaranteed by design. tOSLH = |tPLHm - tPLHn|, tOSHL = |tPHLm - tPHLn|. 2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 8 (per flip-flop). CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
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AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns) DC ELECTRICAL CHARACTERISTICS
Symbol Symbol tOSLH, tOSHL tPLH, tPHL tPLZ, tPHZ tPZL, tPZH Cout fmax ICC IOZ Cin Iin Maximum Three-State Output Capacitance (Output in High-Impedance State) Maximum Input Capacitance Output to Output Skew Output Disable Time, OE to Q Output Enable Time, OE to Q Maximum Propagation Delay, CP to Q Maximum Clock Frequency (50% Duty Cycle) Maximum Quiescent Supply Current Maximum Three-State Leakage Current Maximum Input Leakage Current Parameter Parameter Vin = VCC or GND Vin = VIL or VIH Vout = VCC or GND Vin = 5.5V or GND Test Conditions VCC = 5.0 0.5V (Note 1) VCC = 3.3 0.3V (Note 1) VCC = 5.0 0.5V RL = 1k VCC = 3.3 0.3V RL = 1k VCC = 5.0 0.5V RL = 1k VCC = 3.3 0.3V RL = 1k VCC = 5.0 0.5V VCC = 3.3 0.3V VCC = 5.0 0.5V VCC = 3.3 0.3V Test Conditions 0 to 5.5 VCC V 5.5 5.5 CL = 15pF CL = 50pF CL = 15pF CL = 50pF CL = 15pF CL = 50pF CL = 15pF CL = 50pF CL = 15pF CL = 50pF CL = 15pF CL = 50pF CL = 50pF CL = 50pF CL = 50pF CL = 50pF Min Min 130 85 80 55 TA = 25C Typ TA = 25C 8.1 10.6 10.2 Typ 185 120 130 85 6.1 5.1 6.6 7.1 9.6 5.4 6.9 6 4 Typical @ 25C, VCC = 5.0V 0.25 0.1 Max 4.0 8.1 10.1 14.0 12.7 16.2 Max 11.0 14.5 1.0 1.5 8.8 7.6 9.6 10 TA = - 40 to 85C Min TA = - 40 to 85C Min 110 75 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 70 50 2.5 1.0 40.0 Max 10.0 16.0 13.0 16.5 15.0 18.5 Max 9.0 11.0 9.5 11.5 1.0 1.5 10 Unit Unit A A A pF pF ns ns ns ns ns ns
CPD
Power Dissipation Capacitance (Note 2)
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32 pF
4
NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50pF, VCC = 5.0V)
TA = 25C Symbol VOLP VOLV VIHD VILD Quiet Output Maximum Dynamic VOL Quiet Output Minimum Dynamic VOL Minimum High Level Dynamic Input Voltage Maximum Low Level Dynamic Input Voltage Parameter Typ 0.6 - 0.6 Max 0.9 - 0.9 3.5 1.5 Unit V V V V
TIMING REQUIREMENTS (Input tr = tf = 3.0ns)
TA = 25C Symbol tw tsu th tr, tf Parameter Minimum Pulse Width, CP Minimum Setup Time, D to CP Minimum Hold Time, D to CP Maximum Input Rise and Fall Times Test Conditions VCC = 3.3 0.3 V VCC = 5.0 0.5 V VCC = 3.3 0.3 V VCC = 5.0 0.5 V VCC = 3.3 0.3 V VCC = 5.0 0.5 V VCC = 3.3 0.3 V VCC = 5.0 0.5 V Typ Limit 5.0 5.0 4.5 3.0 2.0 2.0 TA = - 40 to 85C Limit 5.5 5.0 4.5 3.0 2.0 2.0 Unit ns ns ns ns
SWITCHING WAVEFORMS
VCC 50% GND GND tW 1/fmax tPLH Q 50% VCC tPHL Q Q tPZL 50% VCC tPZH 50% VCC tPHZ VOH -0.3V HIGH IMPEDANCE tPLZ HIGH IMPEDANCE VOL +0.3V
VCC CP 50%
OE
Figure 3.
Figure 4.
VALID VCC D 50% GND tsu th VCC CP 50% GND
Figure 5.
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TEST CIRCUITS
TEST POINT OUTPUT DEVICE UNDER TEST CL* DEVICE UNDER TEST TEST POINT OUTPUT 1 k CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH.
CL*
*Includes all probe and jig capacitance
*Includes all probe and jig capacitance
Figure 6.
Figure 7.
D0 3 D C CP OE 11 1 Q
D1 4 D C Q
D2 7 D C Q
D3 8 D C Q
D4 13 D C Q
D5 14 D C Q
D6 17 D C Q
D7 18 D C Q
2 Q0
5 Q1
6 Q2
9 Q3
12 Q4
15 Q5
16 Q6
19 Q7
Figure 8. EXPANDED LOGIC DIAGRAM
INPUT
Figure 9. INPUT EQUIVALENT CIRCUIT
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OUTLINE DIMENSIONS DW SUFFIX SOIC CASE 751D-05 ISSUE F
D
A
11 X 45 _
q
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_
H
M
B
M
20
10X
0.25
E
1 10
20X
B 0.25
M
B TA
S
B
S
A e
SEATING PLANE
h
18X
A1
T
C
DT SUFFIX TSSOP CASE 948E-02 ISSUE A
20X
K REF
M
L
0.15 (0.006) T U
S
0.10 (0.004)
TU
S
V
S
2X
L
PIN 1 IDENT 1 10
B -U-
J J1
N 0.15 (0.006) T U
S
A -V- N F
C D 0.100 (0.004) -T- SEATING
PLANE
G
H
DETAIL E
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IIII IIII IIII
SECTION N-N M DETAIL E
L/2
20
11
K K1
0.25 (0.010)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
-W-
OUTLINE DIMENSIONS M SUFFIX SOIC EIAJ CASE 967-01 ISSUE O
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.81 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.032
20
11
LE Q1 M_ L DETAIL P
E HE
1
10
Z D e A VIEW P
c
b 0.13 (0.005)
M
A1 0.10 (0.004)
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